Grounding & Bonding System Visualizer
Visualize grounding and bonding current paths across service entrances, separately derived sources, generators, and UPS systems — with fault injection showing how grounding method and bonding connections control fault-current return paths.
Overview
Grounding and bonding are two distinct NEC concepts that are routinely confused, misapplied, and inadequately explained. This visualizer separates them visually by animating current paths through a configurable system: the grounded (neutral) conductor, the equipment grounding conductor (EGC), and the grounding electrode conductor (GEC) each appear distinctly, and injecting a ground fault shows which path carries fault current back to the source. Source types include utility service entrance, SDS (separately derived source) transformer, generator, and separately derived UPS. Grounding methods (solidly grounded, high-resistance grounded, ungrounded) and bonding connection location (at source, load-side/sub-panel, or both) are selectable, with real-time feedback on how each combination changes the fault-current path and NEC compliance. The Comparison tab places two configurations side by side. A Scenarios tab covers Normal Operation and Ground Fault at Load. The result is a tool that makes NEC Article 250 tangible rather than purely textual.
App preview
A live look at the app you'll launch — every control on the left drives the visualizations on the right in real time.
Inside the lab
Example data — not a real field report
What you'll do
- 01Distinguish between grounding (earth connection) and bonding (equipotential connection) as defined by NEC Article 250
- 02Trace the fault-current return path for a solidly grounded system versus an ungrounded or HRG system
- 03Identify where the system bonding jumper and main bonding jumper must be installed for each source type
- 04Explain how a separately derived source changes grounding requirements under NEC 250.30
- 05Evaluate the effect of grounding method (solid, HRG, ungrounded) on first-ground-fault behavior
- 06Identify NEC violations when bonding connections are placed in incorrect locations
Try a guided scenario
Trace a ground fault and see what happens when the bonding path is broken.
Grounding and bonding fundamentals · Electrical FoundationsNo sign-in required. Progress is saved on this device.
What this lab is not
- Not a design document, stamped calculation, or approval record.
- Not a substitute for engineering analysis by a licensed professional.
- Not a reproduction of NEC tables — values are computed and cited, and you must verify against the code edition enforced in your jurisdiction.
- Not connected to live equipment and not a safety device.
Calculation basis
References NEC. Results are computed from the entered inputs and cited back to the referencing clause or table number — no code text or table is reproduced verbatim.
Simplifying assumptions are stated in the lab itself; where a model is intentionally conceptual, the lab says so rather than implying study-grade accuracy.
Standards basis: Standards-aware. Validation state: Automated checks only (last checked 2026-08-15).
Who it's for
Tags
- CATEGORY
- Grounding & Bonding
- DIFFICULTY
- Beginner
- AVAILABILITY
- Available
- VALIDATION
- Automated checks only
- STANDARDS BASIS
- Standards-aware
- VERSION
- v2.0
- LAST CHECKED
- 2026-08-15
- REVIEWER OF RECORD
- Unassigned — pending licensed PE technical review
- EST. TIME
- 15–30 min
Status labels are defined on the status definitions page.
Open full appFor education, training, and preliminary support only. Verify results against applicable codes, standards, manufacturer data, project specifications, AHJ requirements, and qualified engineering judgment.
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